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Yiming Yu,Zhilin Chen,Chenxi Zhao,Huihua Liu,Yunqiu Wu,Wen-Yan Yin,Kai Kang
Engineering 2023, Volume 22, Issue 3, Pages 125-140 doi: 10.1016/j.eng.2022.04.023
This article presents a 39 GHz transceiver front-end chipset for 5G multi-input multi-output (MIMOan advanced low-temperature co-fired ceramic process is developed to package the 39 GHz dual-channel transceiverand system-in-package (SIP)-level measurements are conducted to demonstrate the performance of the transceiverSingle-channel communication link testing of the transceiver exhibits an error vector magnitude (EVM)
Keywords： 5G Multi-beam Multi-input multi-output Millimeter-wave Transceiver Wireless communication
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